Empowering the next generation of semiconductor substrates and ultra-hard material processing through China's premier synthetic diamond supply chain.
| Property | Value | Application |
|---|---|---|
| Thermal Conductivity | 2000 - 2200 W/m·K | AI Chip Heat Dissipation |
| Knoop Hardness | 8000 - 10000 kg/mm² | SiC/Sapphire Grinding |
| Chemical Stability | Inert to all acids | Semiconductor CMP |
Estimated Abrasive Loss Rate:
Strategic B2B access to China's leading synthetic diamond manufacturing bases.
PDF • Technical Whitepaper • 1.2 MB
For bulk inquiries, customized substrate specifications, or laboratory collaboration.
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